Bergquist GapFiller1500雙組分液態(tài)間隙填充導(dǎo)熱材料

材料生產(chǎn)商：美國(guó)貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

GapFiller1500可供規(guī)格：

規(guī)格(Specifications): 50CC、400CC、1200CC、10galon

導(dǎo)熱系數(shù)(Thermal Conductivity)：1.8W/m-k

基材(Reinfrcement Carrier)：硅膠

膠面(Glue)：無(wú)

顏色(Color)：黃色/白色

包裝(Pack)：美國(guó)原裝進(jìn)口包裝

持續(xù)使用溫度（Continous Use Temp）：-60°~175°

密度（Density）:2.7g/cc

GapFiller1500應(yīng)用材料特性：

很好的剪切變稀特性（可以很大的提高點(diǎn)膠的速度和設(shè)備的可靠性），高抗流掛性，良好的型狀保持性能，很好貼服性，針對(duì)易碎和低壓力應(yīng)用設(shè)計(jì)，100%固體-沒(méi)有固化副產(chǎn)品

GapFiller1500應(yīng)用：

汽車電子，電腦和周邊，通訊，導(dǎo)熱防震，在任何產(chǎn)生熱量的半導(dǎo)體和散熱器之間

GapFiller1500技術(shù)優(yōu)勢(shì)分析：

GapFiller1500導(dǎo)熱固體膠是雙分組包裝，在使用時(shí)需要使用相應(yīng)的膠槍。膠槍根據(jù)導(dǎo)熱固體膠的容量大小而定。其比例為1:1  所以其A組與B組的容量對(duì)等。

Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinningcharacteristics for optimized consistency and control during dispensing.The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. Gap Filler 1500 exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required. As cured, Gap Filler 1500 provides a soft, thermally conductive, form-inplace elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.